Download: ANSYS 2019R1 Campus Solutions, for Windows 64-bit
Minimum Subscription Required:
The ANSYS Campus Solutions bundle provides access to the majority of offered ANSYS software, including HFSS, Maxwell, SpaceClaim, MAPDL, IcePak and Fluent/CFX. It provides simulation capabilities for structures, heat transfer, fluid dynamics, explicit dynamics, electromagnetics and multiphysics solvers, ANSYS Workbench, CAD import tools, solid modeling, 3-D full wave electromagnetic fields (frequency and time domain), power and signal integrity, 2/3-D parasitic extraction tools & solvers; high performance shared & distributed memory (HPC) solvers, advanced meshing, and post-processing features.
For more information on what is included in this bundle, please refer to the ANSYS Academic Features Product Table at http://www.ansys.com/Products/Academic/Academic-Product-Features-Table.
Licensing Requirements or Restrictions
All CMC Microsystems Canadian Academic account holders from a member university with a Prototyping or Designer Subscription are authorized to access this product. For more information, contact the Licensing Administrator at firstname.lastname@example.org or 613-530-4787.
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