User Guide: CMC's Flip-Chip Assembly Service

User Guide: CMC's Flip-Chip Assembly Service
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The document includes a description of the service procedure that users follow when accessing the flip-chip assembly through CMC and an application example to demonstrate the process and benefits of flip-chip assembly.

The document is intended as a high-level introduction to the flip-chip service provided through CMC. Users must also be familiar with the CMC-supported design fabrication and test environment.

To make most effective use of the flip-chip assembly service users should understand and incorporate the rules during chip design. Some design rules will impact pad arrangement.

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Acknowledging CMC

If your research benefits from products and services provided by CMC Microsystems, please acknowledge this support in any publications about your work. For more information, please visit Acknowledge CMC.