PolyMUMPs technology is a triple polysilicon, single metal surface micromachining process with deposited oxide (PSG) as the sacrificial material, and silicon nitride for electrical isolation from the substrate. CMC also offers optional HF release and supercritical carbon dioxide drying.
This technology allows users to develop acoustics, motion sensors, optical MEMS, etc., and micro-assembly.
The design kit for MEMSPro was developed by SoftMEMS LLC and modified by CMC Microsystems to be compatible with CMC design environment.
The items available for download include:
- design kit with technology file and
- release notes document.