The PolyMUMPs technology is a triple polysilicon, single metal surface micromachining process with deposited oxide (PSG) as the sacrificial material, and silicon nitride for electrical isolation from the substrate. CMC also offers optional HF release and supercritical carbon dioxide drying.
This technology allows users to develop acoustics, motion sensors, optical MEMS, etc. and micro-assembly.
The design kit for MEMSPro was developed by SoftMEMS LLC and includes the PolyMUMPs mask layers for layout, a virtual process to enable users to view a 3D model of their PolyMUMPs designs, and a design rule set to help the user determine the viability of their PolyMUMPs design.
The items for downloading include:
- Design Handbook with process details and design rules/considerations
- Design kit with technology file and Release Notes document.