Application Note: Developing Miniature Power Blocks Attached to Wafer-Scaled IC
This application note describes the development of miniature power blocks for a wafer-scale IC.
Minimum Subscription Required:
Prepared by Oussama Berriah, MSc Candidate (UQTR) Under Supervision of Ahmed Lakhssassi (UQO) and the DreamWafer® Research Team, in co-operation with CMC Microsystems.
This application note captures the design experience of the DreamWafer Team on the development of miniature power blocks. the power blocks are used to supply power to a wafer-scale IC while allowing adequate heat conduction from the wafer-scale IC through the power blocks to the attached heat sinks and providing structural support to the fragile silicon wafer. Thermal, mechanical, and electrical issues are explored in this application note.
All CMC Microsystem account holders with a Prototyping or Designer Subscription are authorized to access this application note. For more information contact Linda Dougherty at email@example.com or 613-530-4787.
|Introduction Date:||November 23, 2010|
|Last Updated:||April 11, 2018|
|Support Level:||Information Only|
|Delivery Method:||CMC Download|
|Client Access:||CMC Download|