Design Guide: Teledyne DALSA MIDIS Platform V1P5

Design Guide: Teledyne DALSA MIDIS Platform V1P5
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This document provides information and design rules to be used for design and physical layout of Inertial Sensors manufactured using TELEDYNE DALSA’s 1.5μm, Bulk Silicon Micromachining Inertial Sensors Technology with WLCSP under vacuum.

Design rules presented in this document are based on a process flow status of the time of the release of the document. Before submitting a physical layout, please make sure you are using the most up to date version of the design rules.

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All CMC Microsystem account holders with a Prototyping or Designer Subscription and have a fully executed copy of the Teledyne DALSA Non-Disclosure Agreement are authorized to access this document. For more information, contact the Licensing Administrator at or 613-530-4787.

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If your research benefits from products and services provided by CMC Microsystems, please acknowledge this support in any publications about your work. For more information, please visit Acknowledge CMC.