Tutorial: FINEPLACER femto Flip Chip Bonder and an Application Example (ICI-329)

Tutorial: FINEPLACER femto Flip Chip Bonder and an Application Example (ICI-329)
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Description

This tutorial explains how to perform a thermocompression bonding using the Fineplacer femto flip-chip bonder. It mainly focuses on setting up the process parameters in the WinFlipChip control software.

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