User Guide: Silicon Photonics Chip-on-Carrier Packaging with DC I/Os and Fibre Pigtails (ICI-339)
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This user guide describes chip design rules for prototyping level clients to access the packaging services provided by Tyndall National Institude, Ireland. It covers the following:
- Configurations and specifications of the PCB-based chip carrier.
- The process flow of CoC wire bonding and fiber grating coupling.
- Design rules for the SOI waveguide chip.
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