Fab: TSMC 0.13 µm CMOS RF Mixed-Signal Process

CMC’s multi-project wafer service is offering the TSMC(CR013G) RF Mixed-Signal technology. This technology has potential applications in RF and mixed-signal systems, and is suitable for:

• RF and Mixed-signal designs
• High-speed digital circuits

The CR013G PDK is available on CMC’s STC. If you do not have STC access, or require TSMC libraries, please contact licensing@cmc.ca.

Process Details

• Technology Features:
  • 1Poly 8Metal Layers
  • 7 Thin {M1-M7}
  • 1 Thick {M8}
  • 1 Ultra Thick Top Metal Layer (Special arrangement)
• Supply Voltage:
  • 1.2V core
  • 2.5V/3.3V I/O

Full documentation is included in the design kit. To access the kit at your institution contact your local STC Manager or email licensing@cmc.ca for instructions.