Fab: TSMC 0.13 µm CMOS RF Mixed-Signal Process

Fab: TSMC 0.13 µm CMOS RF Mixed-Signal Process
Minimum Subscription Required:
Peer Reviewed Price for Canadian Academic
Price for Canadian Academics


Minimum charge is for a
1.1 x 1.1 mm2 design. Other design areas can be quoted upon request.


CMC’s multi-project wafer service is offering the TSMC(CR013G) RF Mixed-Signal technology. This technology has potential applications in RF and mixed-signal systems, and is suitable for:

  • RF and Mixed-signal designs
  • High-speed digital circuits

The CR013G PDK is available on CMC’s STC. If you do not have STC access, or require TSMC libraries, please contact licensing@cmc.ca.

Note: To access the PDK, each individual must sign a Confidential Disclosure Agreement (CDA) - Statement Acknowledging Responsibility.


Process Details

  • Technology Features:
    • 1Poly 8Metal Layers
    • 7 Thin {M1-M7}
    • 1 Thick {M8}
    • 1 Ultra Thick Top Metal Layer (Special arrangement)
  • Supply Voltage:
    • 1.2V core
    • 2.5V/3.3V I/O

Full documentation is included in the design kit. To access the kit at your institution contact your local STC Manager or email licensing@cmc.ca for instructions.

Licensing Requirements or Restrictions

Individual researchers must sign the CONFIDENTIAL DISCLOSURE AGREEMENT and return it to licensing@cmc.ca. For more information, contact our License Administrator at licensing@cmc.ca or call 613-530-4787.

Acknowledging CMC

If your research benefits from products and services provided by CMC Microsystems, please acknowledge this support in any publications about your work. For more information, please visit Acknowledge CMC.