Design Kit: Interposer Platform PDK for 2.5D Integration
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Cost-effective, fast-turnaround manufacturing platform for 2.5D integration of heterogeneous chip technologies in a compact form factor. Supported by a comprehensive environment for design, manufacturing, and test of physical prototypes. Amenable to laboratory testability and field-trial demonstration. Developed in partnership with Innotime Technologies Inc.
- 400-μm thick silicon substrate with array of silver-filled Through Silicon Vias (TSVs) connecting top and bottom metal layers
- 3 customizable metal redistribution layers (RDLs) to route electrical signals between flip-chipped or wire-bonded die as well as off-the-shelf components such as SMT, SOIC or CSP
- Bottom metal layer can be used for routing or for mounting a standard ball grid contact array (BGA).
- Tanner L-Edit/S-Edit tools for design entry
- PDK supports standard design components and primitives, design and verification tasks (e.g., auto-routing, LVS and DRC) and output file formats such as GSDII for hand-off to manufacturing.
- Library of design footprints for adding off-the-shelf components
- Designers can quickly and easily place custom and/or off-the- shelf components on the interposer TSV array and customize the routing of electronics signals between the components and through to the back side BGA layer.
Test and Validation Infrastructure
- Prototypes can be mounted on breakout boards or ZIF sockets for interfacing to test equipment or hardware such as FPGA boards for device and system test, characterization and application development.
- Test and programmable hardware available through CMC Equipment Pool for short-term access.
- A test chip and test report demonstrates key parameters and operating constraints for this technology.
- PDK V2.1
- User Guide
- Reference designs and training materials
- Tanner L-Edit/S-Edit design tools
- Engineering support
- Interposer Manufacturing Service
Licensing Requirements or Restrictions
All CMC Microsystem account holders with a Professor Research Subscription are authorized to access this technology. Contact our Licensing Administrator at firstname.lastname@example.org or 613-530-4787 for more information.
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