Design Guide: 3IT Chip-to-PCB Solder Assembly Service (ICI-372)
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This document is intended as a guide for researchers who require access to assembly services for Silicon microchips to be mounted and electrically contacted to a Printed Circuit Board (PCB) using a soldering process.
This document defines requirements relating to bond pad layout and metallurgy that must be respected to ensure compliance with the service offered by the 3IT.micro laboratory at the University of Sherbrooke. The chip-to-PCB bonding process is based on a surface mount technology approach. Previous work at 3IT has validated a process for the solder bonding of chips to PCBs, in the case where those chips had already been solder-bumped. In the current work, we extend this capability by describing a process in which tin-silver-copper alloy solder (SAC305) is applied to the chip bond pads, and those solder-bumped chips are bonded to a PCB. The process has been verified for chip contact pads that are “Au-finished” (i.e., the uppermost metal layer in the contact pad is Au), mating to Au-finished PCB pads.
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