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Application Note: Heterogeneous Integration of a Microelectronic Driver and Silicon Photonic Device for Data Communications Applications
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Description of the tests conducted to estimate the parasitics associated with flip-chip bonding of CMOS chips
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Application Note: Evaluating Flip-Chip Bonding Packaging Parasitics
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Description of the tests conducted to estimate the parasitics associated with flip-chip bonding of CMOS chips
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Application Note: Implementation of High-Speed Chip-To-Chip Communication Links Using Die-On-Board Flip-Chip Technology
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Implementation of high-speed chip-to-chip communication links using die-on-board flip-chip technology
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Application Note: Design and Fabrication of Bond Pads for Flip-Chip Bonding of Custom Dies to CMOS Dies
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This application note describes design and fabrication of bond pads for flip-chip bonding of custom dies to CMOS dies. Options on processes and materials are presented to help determine the best approach for this application.
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Application Note: Hybrid Integration of Custom CMOS Sensor Chips on a Glass Microfluidic Substrate, Using a Solder Bump Flip-Chip Assembly Technology
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Description of the hybrid integration of custom CMOS sensor chips on a glass microfluidic substrate
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Application Note: Using Flip-chip Assembly on Glass Slides for Hybrid Integration of CMOS/ Microfluidics
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Description of a hybrid assembly procedure for the integration of custom sensors and actuators atop glass microfluidic substrates
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Application Note: Bonding a Silicon Electrode Array to a CMOS Chip Using a Customized Flip-Chip Process
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Description of the flip-chip technique used by CMC to assist the study of electrical signals in the brain tissue of test animals
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Application Note: Gold Stud Bump Flip Chip Assembly of a Micromirror Device
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This application note demonstrates a flip-chip-based post processing fabrication technique for micromirror devices manufactured by the MEMSCAP MUMPs services available through CMC Microsystems.
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