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Application Note: Silicon Etching Process Using Laser Milling Techniques
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This application note proposes a silicon etching process based on a laser milling technique as an alternative to the reactive ion etching (RIE) process that is commonly use to etch and release silicon structures.
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Application Note: Characterization of Anisotropic Conductive Film Based on Vertical Fibers for Post-CMOS Wafer-Level Packaging
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This product is an application note capturing the use of anisotropic conductive film in a wafer-level prototype.
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Application Note: Low Temperature Co-Fired Ceramic Design Flow
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The application note demonstrates the design flow for LTCC technology.
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Application Note: Small Die Handling for Post-Processing using ICP-DRIE
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Description of a series of microfabrication steps aimed at handling and post-processing a small complementary metal–oxide–semiconductor (CMOS) die
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Application Note: Silicone Encapsulation of Mechanically Flexible Multilayer Integrated System on Polymer Substrate for Medical Applications
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Description of a set of basic guidelines for encapsulating small electronic components on multilayered mechanically flexible polymer substrates
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Application Note: Preparing and Exporting Ansoft Designer Layout Files for Use with T-Tech IsoPro Milling Software
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Procedures to prepare and export Ansoft Designer Planar EM layouts to an intermediate format compatible with most milling software
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Application Note: Guidelines for Designing Printed Circuit Boards Using Polyimide Materials
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Summary of CMC’s experiences and insights in the use of polyimide (FLEX) materials for printed circuit boards (PCBs)
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Application Note: Assembly of a Compact Fluorescence Detection/Imaging System to Detect Biological Materials
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Description of a compact fluorescence detection/imaging system for detecting biological materials
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Application Note: Addition of Microelectrode Arrays on CMOS Die Using Gold Stud Bumping for Neural Interfacing Applications
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Description of adding microelectrode arrays on CMOS die using gold stud bumping for neural interfacing applications
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Application Note: A Procedure for Mounting Loose Integrated Circuit Die on a Non-Conductive Glass Substrate
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Description of a technique for directly mounting loose integrated circuit (IC) die on a non-conductive glass surface
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Application Note: Post-Processing Techniques to Address Challenges in Die Handling; Mask Alignment; and Edge Bead Infringement
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Description of techniques to prepare individual semiconductor die for post processing
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