Application Note: Silicone Encapsulation of Mechanically Flexible Multilayer Integrated System on Polymer Substrate for Medical Applications

This application note was prepared for for CMC by Yindar Chuo, Masters Student, CIBER Labs, Simon Fraser University. It provides a set of basic guidelines for encapsulating small electronic components on multilayered mechanically flexible polymer substrates.

An application example in the area of tiny wearable electronics for medical healthcare is provided. However, the described techniques can be extended to other packaging requirements.

CMC is collaborating with researchers at Canadian universities to build a library of microsystems application notes. These documents are intended to help extend microsystems research in Canada by describing new techniques, processes, and design tools relating to microsystems, and to help stimulate new ideas that accelerate research and development activities.

All CMC Microsystem account holders with a Prototyping or Designer Subscription are authorized to access this application note. For more information contact Linda Dougherty at licensing@cmc.ca or 613-530-4787.