Application Note: Design and Fabrication of Bond Pads for Flip-Chip Bonding of Custom Dies to CMOS Dies

Application Note: Design and Fabrication of Bond Pads for Flip-Chip Bonding of Custom Dies to CMOS Dies
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Description

Prepared by Orit Skorka and Dileepan Joseph, Electrical and Computer Engineering, University of Alberta.

This application note describes design and fabrication of bond pads for flip-chip bonding of custom dies to CMOS dies. Options on processes and materials are presented to help determine the best approach for this application.

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