Application Note: Implementation of High-Speed Chip-To-Chip Communication Links Using Die-On-Board Flip-Chip Technology
-
Minimum Subscription Required:
-
Research
-
Price for Canadian Academics
-
$0.00
Description
Prepared by Mike Bichan, Ph.D. candidate, Electrical Engineering, University of Toronto.
This application note describes the implementation of high-speed chip-to-chip communication links using die-on-board flip-chip technology. Separate CMOS transmitter and receiver dies are to be flip-chip bonded to a FR-4 test PCB. The signal links are established through microstrip traces on board.
Licensing Requirements or Restrictions
All CMC Microsystems account holders with a Subscription are authorized to access this product. For more information, contact the Licensing Administrator at licensing@cmc.ca.
Acknowledging CMC
If your research benefits from products and services provided by CMC Microsystems, please acknowledge this support in any
publications about your work. For more information, please visit
Acknowledge CMC.