Design Library: TSMC 65 nm GP Bond Pad Library - tpbn65v
Minimum Subscription Required:
Price for Canadian Academics
This is the bond pad library for TSMC 65nm general-purpose CMOS (to be used with tpzn65gpgv2).
Licensing Requirements or Restrictions
All CMC Subscribers are authorized to access this technology. Contact the Licensing Administrator at firstname.lastname@example.org or 613-530-4787 for more information.
If your research benefits from products and services provided by CMC Microsystems, please acknowledge this support in any
publications about your work. For more information, please visit