Application Note: Top-Down Approach to Design and Simulate Mixed-Signal Chips Using VerilogA/Schematic/Layout Representation
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A top-down approach to designing mixed-signal microelectronic chips using Cadence Spectre Simulator from Cadence Design Systems, Inc.
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Product Details
Description
Product Description
Prepared by Marco Macedo, M.Eng. Candidate, ECE, McGill University, in co-operation with CMC Microsystems.
This application note explains a top-down approach to designing mixed-signal microelectronic chips using Cadence Spectre Simulator from Cadence Design Systems, Inc. (http://www.cadence.com). This approach employs the VerilogA language used to model analog and digital circuits.
All CMC Microsystem account holders with a Prototyping or Designer Subscription are authorized to access this application note. For more information contact Linda Dougherty at licensing@cmc.ca or 613-530-4787.
Support
Support Information
Product Specialist: | |
Version: | 1.0 |
Status: | Released |
Introduction Date: | February 24, 2011 |
Last Updated: | April 21, 2022 |
Support Level: | Information Only |
Delivery Method: | CMC Download |
Client Access: | CMC Download |