Design Kit: Teledyne DALSA MIDIS Platform V1P5, for Coventorware

Design Kit: Teledyne DALSA MIDIS Platform V1P5, for Coventorware
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The MEMS Integrated Design for Inertial Sensors (MIDIS™) platform is designed to provide a standard process for manufacturing accelerometers and gyroscopes and integrating them into an Inertial Measurement Unit (IMU) for consumer (mobile), automotive, and sports/health markets.


  • Getter free high vacuum sealing allows resonator Q factors > 20,000
  • Efficient wafer level packaging minimizes overall die size
  • 1.5-μm feature size in a 30-μm thick membrane
  • Comb height control allows out-of-plane sensing
  • TSV allows compact design ready for co-packaging

Licensing Requirements or Restrictions

All CMC Microsystem account holders with a Designer subscription are authorized to access this technology. Contact the Licensing Administrator at or 613-530-4787 for more information.

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