Design Kit: Teledyne DALSA MIDIS Platform V1P5, for Tanner L-Edit

This is the Teledyne DALSA MIDIS™ design kit for Tanner L-Edit.

The MEMS Integrated Design for Inertial Sensors (MIDIS™) platform is designed to provide a standard process for manufacturing accelerometers and gyroscopes and integrating them into an Inertial Measurement Unit (IMU) for application areas such as consumer (mobile), automotive, aerospace and sports/health markets.

The MIDIS Platform is being offered as Multi-Project-Wafer (MPW) service through CMC Microsystems and is available for both academic and industrial R&D. Together CMC and Teledyne DALSA offer a seamless path from MPW design confirmation to volume manufacturing.

Features

• Getter-free high-vacuum sealing allows resonator Q factors > 20,000
• Efficient wafer-level packaging minimizes overall die size
• 1.5 μm feature size in a 30 μm thick membrane
• Comb height control allows out-of-plane sensing
• TSV allows compact design ready for co-packaging
• Deliver 40 copies for each design

Applications

• Accelerometers
• Gyroscopes
• Resonators
• Inertial sensor combos (Sensor fusion)

Additional Services Available

• CAD tools
• Design kits (Cadence, Coventorware, Tanner/MEMSPro L-Edit)
• Access to CMC support engineers
• Design rule checking services
• Documentation including design handbooks, application notes and design methodologies
• Packaging & assembly services