Fab: PolyMUMPs Multi-User MEMS Process Technology
Minimum Subscription Required:
Peer Reviewed Price for Canadian Academic
Price for Canadian Academics
CMC’s multi-project wafer service delivers the MUMPs technology, through a partnership with MEMSCAP Inc..
The PolyMUMPs technology is a triple polysilicon, single metal surface micromachining process with deposited oxide (PSG) as the sacrificial material, and silicon nitride for electrical isolation from the substrate. CMC also offers optional HF release and supercritical carbon dioxide drying.
- 3-layer polysilicon surface micromachining with minimum feature size down to 2 μm
- 1 gold layer deposited on top polysilicon layer for wiring and contact pads
- 2 sacrificial layers to release the top 2 polysilicon structural layers.
Potential applications include:
- Sensors and actuators
|Note: The expected number of chips to be delivered for this technology is 15.
Licensing Requirements or Restrictions
Please see Help with Licensing
to review licensing procedure. For more information, contact our License Administrator at email@example.com
If your research benefits from products and services provided by CMC Microsystems, please acknowledge this support in any
publications about your work. For more information, please visit