Fab: PolyMUMPs Multi-User MEMS Process Technology

Fab: PolyMUMPs Multi-User MEMS Process Technology
Minimum Subscription Required:
Research
Peer Reviewed Price for Canadian Academic
$325.00
Price for Canadian Academics
$900.00

Description

CMC’s multi-project wafer service delivers the MUMPs technology, through a partnership with MEMSCAP Inc..

The PolyMUMPs technology is a triple polysilicon, single metal surface micromachining process with deposited oxide (PSG) as the sacrificial material, and silicon nitride for electrical isolation from the substrate. CMC also offers optional HF release and supercritical carbon dioxide drying.

Process Details

  • 3-layer polysilicon surface micromachining with minimum feature size down to 2 μm
  • 1 gold layer deposited on top polysilicon layer for wiring and contact pads
  • 2 sacrificial layers to release the top 2 polysilicon structural layers.

Potential applications include:

  • Acoustics
  • Sensors and actuators
  • Micromirrors
  • Micro-assembly 

Note: The expected number of chips to be delivered for this technology is 15.

Licensing Requirements or Restrictions

Please see Help with Licensing to review licensing procedure. For more information, contact our License Administrator at licensing@cmc.ca or 613-530-4787.

Acknowledging CMC

If your research benefits from products and services provided by CMC Microsystems, please acknowledge this support in any publications about your work. For more information, please visit Acknowledge CMC.