Fab: PolyMUMPs Multi-User MEMS Process Technology
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Minimum Subscription Required:
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Research
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Price for Canadian Academics
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$900.00
Description
CMC’s multi-project wafer service delivers the MUMPs technology, through a partnership with MEMSCAP Inc..
The PolyMUMPs technology is a triple polysilicon, single metal surface micromachining process with deposited oxide (PSG) as the sacrificial material, and silicon nitride for electrical isolation from the substrate. CMC also offers optional HF release and supercritical carbon dioxide drying.
Process Details
- 3-layer polysilicon surface micromachining with minimum feature size down to 2 μm
- 1 gold layer deposited on top polysilicon layer for wiring and contact pads
- 2 sacrificial layers to release the top 2 polysilicon structural layers.
Potential applications include:
- Acoustics
- Sensors and actuators
- Micromirrors
- Micro-assembly
Note: The expected number of chips to be delivered for this technology is 15.
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Licensing Requirements or Restrictions
Please see
Help with Licensing to review licensing procedure. For more information, contact our License Administrator at
licensing@cmc.ca or 613-530-4787.
Acknowledging CMC
If your research benefits from products and services provided by CMC Microsystems, please acknowledge this support in any
publications about your work. For more information, please visit
Acknowledge CMC.